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    • Home
    • ESD Test
      • ISO10605
      • IEC61000-4-2
      • IEC60601-1-2
      • RTCA DO-160G
      • MIL-STD-461 CS118
    • Trans Immunity
      • ISO7637-2
      • ISO7637-3
      • ISO16750-2
      • JASO D001-94
      • Japanese OEM Tests
    • Immunity Test
      • ISO11452-2
      • ISO11452-3
      • ISO11452-4
      • ISO11452-8
      • ISO11452-9
    • Emission Test
      • CISPR25
    • Reliability
      • Temperature
      • Temperature & Humidity
      • Life Endurance Tests
      • Free Fall Test
    • Connect
  • Home
  • ESD Test
    • ISO10605
    • IEC61000-4-2
    • IEC60601-1-2
    • RTCA DO-160G
    • MIL-STD-461 CS118
  • Trans Immunity
    • ISO7637-2
    • ISO7637-3
    • ISO16750-2
    • JASO D001-94
    • Japanese OEM Tests
  • Immunity Test
    • ISO11452-2
    • ISO11452-3
    • ISO11452-4
    • ISO11452-8
    • ISO11452-9
  • Emission Test
    • CISPR25
  • Reliability
    • Temperature
    • Temperature & Humidity
    • Life Endurance Tests
    • Free Fall Test
  • Connect

ISO7637-3

CCC

CCC

CCC

Automotive Conducted Transient Immunity ISO7637-3 CCC Capacitive Coupling Clamp Test

This method involves using a capacitive clamp to inject fast pulses onto data or communication lines.

To evaluate the immunity of devices under test (DUTs) to transient pulses. These pulses simulate disturbances caused by the switching of inductive loads and relay contact bounce.

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ICC

CCC

CCC

Automotive Conducted Transient Immunity ISO7637-3 CCC Inductive Coupling Clamp Test

This method uses an inductive clamp to inject pulses onto the line.

To evaluate the immunity of devices under test (DUTs) to transient pulses. These pulses simulate disturbances caused by the switching of inductive loads and relay contact bounce.

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DCC

CCC

DCC

Automotive Conducted Transient Immunity ISO7637-3 CCC Direct Coupling Clamp Test


This method directly couples the test pulses to the lines under test.

 To evaluate the immunity of devices under test (DUTs) to transient pulses. These pulses simulate disturbances caused by the switching of inductive loads and relay contact bounce.

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